• Commissioned December 2005
• Gaussian beam step and exposure writing strategy Thermal Field Emission gun with 50kV and 100 kV operation
• 50 MHz pattern processor
• distributed processing power for fast pattern transcription and run times
• extra wide field deflection (EWF) system to 1.3 mm at 50 kV and 100kV a range of substrate types up to 200 mm in size
• multi substrate load lock
• ultra high resolution (UHR) performance with minimum spot size around 4 nm
• measurement resolution 0.62 nm ( lambda/1024)
• Automatic aperture changer and alignment
• Buffered shape server to deliver typically 60,000 shapes/sec